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Showing items 1 through 10 of 185.
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IEC TR 60068-3-15:2024
Environmental testing - Part 3-15: Supporting documentation and guidance - Vacuum-assisted reflow solderingiec (not verified)
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IEC TR 61760-5-1:2024
Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip componentsiec (not verified)
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IEC TS 62878-2-10:2024
Device embedding assembly technology - Part 2-10: Design specification for cavity substrateiec (not verified)
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IEC 63215-2:2023
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devicesiec (not verified)
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IEC 63215-2:2023
Méthodes d’essai d’endurance pour les matériaux de fixation de puce - Partie 2: Méthode d’essai de cycle thermique pour les matériaux de fixation de puce, appliquée aux dispositifs électroniques de puissance de type discretiec (not verified)
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IEC TR 61191-9:2023
Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practicesiec (not verified)
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IEC TR 60068-3-12:2022
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profileiec (not verified)
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IEC PAS 61191-10:2022
Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assembliesiec (not verified)
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IEC TR 61760-3-1:2022
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing methodiec (not verified)
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IEC TR 62878-2-9:2022
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industriesiec (not verified)