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Showing items 1 through 10 of 638.
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IEC TS 62878-2-10:2024
Device embedding assembly technology - Part 2-10: Design specification for cavity substrateiec (not verified)
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IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stressiec (not verified)
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IEC 63251:2023
Méthode d’essai des propriétés mécaniques des circuits optoélectriques souples sous contrainte thermiqueiec (not verified)
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IEC 61189-2-804:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300iec (not verified)
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IEC 61189-2-804:2023
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-804: Méthodes d'essai pour le temps de décollement interlaminaire - T260, T288, T300iec (not verified)
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IEC 62899-202-10:2023
Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layeriec (not verified)
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IEC 62899-202-9:2023
Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical testiec (not verified)
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IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materialsiec (not verified)
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IEC 61189-2-801:2023
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-801: Essai de conductivité thermique pour matériaux de baseiec (not verified)
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IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boardsiec (not verified)